Thermo-Electro-Mechanical Analysis of a Curved Functionally Graded Piezoelectric Actuator with Sandwich Structure

In this work, the problem of a curved functionally graded piezoelectric (FGP) actuator with sandwich structure under electrical and thermal loads is investigated. The middle layer in the sandwich structure is functionally graded with the piezoelectric coefficient g31 varying continuously along the radial direction of the curved actuator. Based on the theory of linear piezoelectricity, analytical solutions are obtained by using Airy stress function to examine the effects of material gradient and heat conduction on the performance of the curved actuator. It is found that the material gradient and thermal load have significant influence on the electroelastic fields and the mechanical response of the curved FGP actuator. Without the sacrifice of actuation deflection, smaller internal stresses are generated by using the sandwich actuator with functionally graded piezoelectric layer instead of the conventional bimorph actuator. This work is very helpful for the design and application of curved piezoelectric actuators under thermal environment.